Construction of electronic chip factories

I. Business Overview

The chip factory engineering focuses on the construction of high-standard clean Spaces for high-end electronic industries such as semiconductor manufacturing and integrated circuit production, covering the entire process of services including factory planning, cleanroom design, special decoration, system integration and intelligent operation and maintenance. In response to the strict requirements of chip manufacturing processes for cleanliness (ISO Class 1-5), temperature and humidity accuracy (±0.1℃), anti-micro-vibration (VC-D class), anti-static (≤1×10⁶Ω), and AMC (gaseous molecular contaminants) control, we offer an overall solution ranging from process layout optimization to environmental control. By integrating the production process flow line, equipment installation prediction, and personnel movement line isolation design, it ensures that the factory building meets the requirements of chip mass production yield and long-term stable operation.

Il. Core Service Contents

1. Process-oriented factory planning and design

- Clean grade zoning: Clean grades (ISO Class 1-5) are classified according to functions such as lithography area, etching area, and packaging area, and dynamic pressure difference gradient and air flow organization are designed.

- Anti-micro-vibration and sound insulation design:

Independent anti-micro-vibration foundation construction, isolated from external vibration interference.

The Raised Floor system, combined with an elastic support structure, reduces resonance during equipment operation.

- Anti-static and clean environment integration:

Anti-static epoxy flooring throughout the entire area (surface resistance 10⁴-10⁶Ω), with pre-embedded grounding copper foil grids.

- FFU (Fan Filter Unit) ceiling system + chemical filter, controlling AMC concentration ≤1ppb.

2. High-precision special decoration construction

- Structural Engineering:

Reinforcement of large-span steel structure factory buildings to meet the load-bearing requirements of heavy equipment such as photolithography machines.

Customized treatment of seismic joints and settlement joints ensures the stability of the building.

- Cleanroom decoration

- Wall surface: Electrolytic steel plate + seamless welding process, joint air tightness ≤0.01mm.

- Ceiling: FFU integrated aluminum honeycomb clean board, with a coverage rate of ≥25%.

- Floor: Raised floor system (flatness ±1mm/2m), with static dissipation coating.

Special area construction:

Yellow light illumination and anti-exposure design for the lithography area.

Leak-free welding and passivation treatment of bulk gas (N₂, Ar) pipelines.

3. Core system integration

- Clean environment control system:

The constant temperature and humidity unit (accuracy ±0.1℃/±1%RH) is interlinked with the MAU+DC system.

Insulation and anti-condensation construction for process cooling water (PCW) pipelines.

- Intelligent operation and maintenance system

Real-time data dashboard for environmental monitoring (PM0.1 particles, VOCs, temperature and humidity).

The equipment energy management system (EMS) is integrated with the MES/CIM production system.

- Safety and Environmental Protection System:

Integrated Scrubber treatment device for acidic waste gas.

Emergency power supplies (UPS/EPS) and fire gas extinguishing systems are installed in a concealed manner.